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RDChemical

 

RD Chemical is known as the "Innerlayer Chemistry Company" supplies application-specific process chemicals for the Printed Circuit Board, Chemical Milling, and Semiconductor Packaging Industries.

  • TerClean (RD-01) A general purpose orange Terpene based cleaner.

  • HASL Pre-Cleaner SL (RD-08) An alkaline pre-HASL (or alternative finish) cleaner.

  • MicroClean ZE (RD-10) A low foam cleaner/nanoetch; replaces microetch before HAL.

  • FlexClean DM (RD-11) Powerful, non-foaming, free rinsing, buffered alkaline cleaner for flex circuits. Organic substrate attack inhibitor.

  • MicroClean NE (RD-15) A low foam cleaner/nanoetch, spray or immersion, low metal pickup.

  • MicroClean S (RD-17) Copper Cleaner/Oxide and Chromate Remover.

  • MicroClean CuL (RD-19) An alkaline spray cleaner for cleaning copper & iron alloy foils.

  • DefoamerA (RD-28) A fully organic non-Silicone water soluble defoamer for full aqueous resist strippers. Cost-effective and free rinsing.

  • ChemStrip NXT (RD-30) A single part, high capacity nitric acid-based stripper.

  • Equipment Cleaner (RD-34) All purpose product for removal of water hardness, photoresist and metal salt deposits from chemical processing equipment

  • In-Process Defoamer (RD-36) Fully organic non-Silicone water soluble defoamer for use in developers or other spray systems where clean rinsing is essential.

  • ChemStrip 99 (RD-37) Liquid additive to nitric acid rack strippers.

  • Sodium Carbonate, PhotoResist Developer (RD-39) Economical dry form, hydrated Sodium Carbonate which dissolves readily in water.

  • Developer HC (RD-41) Highly concentrated, for full aqueous dry film photoresists.

  • Developer Defoamer (RD-43) Water soluble defoamer, non-Silicone, for use in developers or other spray systems.

  • ChemPosit Sn (RD-51) Immersion "White" Tin Final Finish.

  • ChemStrip TL (RD-52) An ultrafast one-step tin/lead stripper for immersion or spray applications.

  • ResiStrip L (RD-56) A long-lived alkaline stripper for full-aqueous dry film photoresist; long life, no tarnish.

  • ChemPrep (RD-58)Multipurpose, high activity copper surface prep.

  • ResiStrip (RD-61) High-Speed Alkaline Stripper for Semi- or Full-Aqueous Dry Film Photoresist

  • TinPlate R/T (RD-63) Liquid low temperature immersion tin plating for copper, tin/lead and other metals.

  • MicroClean CuLX (RD-68) An alkaline soak cleaner for cleaning copper & iron alloy foils; powerful, non-tarnishing.

  • Silicone Defoamer (RD-71) A concentrated defoamer for use in waste water treatment.

  • ResiStrip PC (RD-76) A high speed dry film photoresist stripper; small particles.

  • Circuit Prep (RD-81) A preplating cleaner for use with dry film photoresist.

  • SatinEtch (RD-83) A cost-effective fine-definition etch process for use prior to plating or oxide deposition.

  • Unietch (RD-84) Microetch for copper.

  • MaskStrip (RD-85) High capacity solder mask stripper.

  • HAL Flux (RD-88) The definitive flux for any type of Hot Air Leveled circuit board.

  • ResiStrip A (RD-96) A high-speed stripper for full aqueous photoresist.

  • UltraDeveloper (RDX-1076) Developer & cleaner for full aqueous dry film photoresists & soldermasks.

  • Paladin (RDX-1200) Immersion Palladium plating bath, for Flat Final Finish.

  • Paladin Catalyst (RDZ-1354) Catalyst for electroless nickel, only catalyzes copper, not laminate or soldermask.

  • ResiStrip™SP (RDZ-1398) A High Speed Dry Film Photoresist Stripper.

  • De-Ox (RDZ-1556) A Cleaner/Deoxidizer for Electrical Contacts.

  • ResiStrip™ EC-1 (RDZ-1590) Very Low Cost, Innerlayer Photoresist Stripper.

  • ResiStrip™ EC-2 (RDZ-1591) Very Low Cost, Small Particle Innerlayer Photoresist Stripper.

  • ResiStrip™ EC-3 (RDZ-1592) The Low-Priced Small Particle Innerlayer Photoresist Stripper.

  • Aluminum Cleaner (RDZ-1593) Cleaner/desmut for Aluminum alloys for Disc Drives.

  • ChemBond™ EC (RDZ-1601/1602) Oxide Replacement The Alternate Oxide for Lamination Adhesion.

  • MicroClean™ EC-1 (RDZ-1603) Acid Copper Cleaner/Oxide and Chromate Remover.

  • MicroClean™ EC-2 (RDZ-1604) Acid Copper Spray Cleaner.

  • MicroClean™ EC-3 (RDZ-1605) An Alkaline Spray Cleaner for cleaning Copper Foils.

  • MicroClean™ EC-4 (RDZ-1606) Acid Copper Cleaner/Oxide and Chromate Remover.

  • Developer EC-1 (RDZ-1607) For Full Aqueous Dry Film Photoresists.

  • Developer EC-2 (RDZ-1608) For Full Aqueous Dry Film Photoresists.

  • Developer EC-3 (RDZ-1609) Sodium Carbonate Monohydrate.

  • Defoamer EC-D (RDZ-1610) Non-Silicone for Photoresist Developers.

  • Defoamer EC-S (RDZ-1611) To Defoam ResiStrip™ EC-1.

  • Defoamer EC-S2 (RDZ-1612) Non-Silicone, for use in Photoresist Strippers or other Spray Systems.

  • Nitinol Polish (RDZ-1616) Nitinol Deoxidizer-Polish.

  • ChemPolish™ DD (RDZ-1627) For Particulate Removal From 300 Series Stainless Steel.

  • Aluminum DCPR (RDZ-1642) Aluminum Deoxidizer/Desmut for Disc Drives.

  • HAL Flux EC2 (RDZ-1643) The low cost flux for any type of Hot Air Leveled circuit board.

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